Process of adhesive bonding with patternable polymers for producing microstructure devices on a wafer assembly

摘要

A process for adhesive bonding of polymer layers between silicon substrates is disclosed for forming three-dimensional micro-structures on a silicon wafer. A base substrate such as a silicon wafer is provided and a coating step places at least one polymer thereon. At least one pattern is created in the polymer to form a plurality of channels and gaps in the polymer layer prior to precuring and curing. A second substrate is aligned adjacent to the base substrate and having the patterned polymer therebetween. The substrates and patterned polymer are cured under a vacuum and at selected temperatures to induce compression of the polymer between the substrates while retaining voids, channels and gaps in the polymer layer. Cooling forms layered polymer layers having voids, channels and gaps therein, forming three-dimensional micro-structures actuated by one or more optical, mechanical and fluidic forces to accomplish complex functions by the micro-structures.