| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, along with its manufacturing method, capable of preventing peeling or cracking of a passivation film in an element formation region of a semiconductor chip. <P>SOLUTION: At a top surface layer part of a semiconductor chip 1, an annular groove 12 is so formed as to surround an element formation region A in such top view as looks down upon the surface of the semiconductor chip 1. A passivation film 11 is separated into a central side part 111, on the inner side, and a peripheral side part 112, on the outer side, across the groove 12. A sealing resin layer 4 enters the groove 12 between the central side part 111 and the peripheral side part 112. <P>COPYRIGHT: (C)2007,JPO&INPIT |
