| 摘要 |
A photodetector system is provided to electrically integrate a processing electronic device by including a wide bandgap photodetector array physically and electrically integrated on a flexible interconnection layer including an electrical connection part. A photodetector system(10) includes a wide bandgap photodetector array(12), a processing electronic device(14) and a packing(16) including a flexible interconnection layer(18) having an electrical connection part(20). The flexible interconnection layer includes a conformal layer. The package is structured to electrically incorporate the photodetector array and the processing electronic device. The packing and the processing electronic device are structured to be processed by obtaining a signal detected by the photodetector array. The photodetector array includes a gallium nitride photodetector, a zinc oxide photodetector, a diamond photodetector or a composition thereof.
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