发明名称 ELECTROLESS PALLADIUM PLATING LIQUID, AND THREE LAYER-PLATED FILM TERMINAL FORMED USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electroless palladium plating liquid where, in a three layer plating film terminal of an electroless nickel plating film/ an electroless palladium plating film/a substitution gold plating film, a gold film is formed only by easily treatable substitution gold plating, and, even when electroless nickel-phosphorous having high flexibility is used, which has excellent joining strength in both of wire bonding joining and solder ball joining, and has excellent running properties as well. SOLUTION: The electroless palladium plating liquid at least comprises: a component (a): a palladium salt organic complex; a component (b): sulfide group-containing monocarboxylic acid or the salt thereof; and a component (c): hypophosphorous acid or the salt thereof. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007009305(A) 申请公布日期 2007.01.18
申请号 JP20050194740 申请日期 2005.07.04
申请人 JAPAN PURE CHEMICAL CO LTD 发明人 SHIMIZU SHIGEKI;KIYOHARA KANZO;TAKAHASHI RYOICHI
分类号 C23C18/44;C23C18/52;H01L23/12 主分类号 C23C18/44
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