发明名称 DOUBLE FLOOR STRUCTURE AND FLOOR PANEL USED THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a double floor structure simple in construction and superior in thermal insulation performance, while firmly and stably connecting mutual adjacent floor panels. SOLUTION: This double floor structure is formed by firmly connecting and juxtaposing the mutual floor panels 5A to 5E via a connecting plate material 62, while supporting these floor panels 5A to 5E in a predetermined height position by support legs 2 to 4, by using a plurality of floor panels 5A to 5E formed by integrally installing a floor backing plate 60, thermal insulation materials 61A to 61E and the connecting plate material 62. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007009541(A) 申请公布日期 2007.01.18
申请号 JP20050191893 申请日期 2005.06.30
申请人 SEKISUI HOUSE LTD 发明人 NAKAJIMA YASUO;SUGIHARA MASAMI;OTANI YASUNORI;SAKATA YOSHIYASU;NOGUCHI SATOSHI
分类号 E04F15/024;E04B5/43;E04F15/00;E04F15/02;E04F15/18 主分类号 E04F15/024
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