| 摘要 |
PROBLEM TO BE SOLVED: To provide a means capable of suppressing the bending of a printing mask by simply holding even a printing mask surface, in the time of the cream solder printing process for mounting a substrate. SOLUTION: A cream solder 7 is printed to a mounting substrate 2 by arranging a mounting substrate 2 on a stage 1, and by arranging a printing mask 5 on the mounting substrate 2, while moving and pressing a printing squeegee 6 onto the printing mask 5 by applying and spreading the cream solder 7. In the cream solder printing method at a predetermined place of the space produced between the stage 1 and the printing mask 5, based on the thickness of the mounting substrate 2, a support material 4 is arranged so that both the support material 4 and the mounting substrate 2 may suppress the bending of the printing mask 5 caused by pressure. By this way, at the time of cream solder printing to the mounting substrate 2, it is made possible to hold even the surface of the printing mask 5, and to suppress the bending of the printing mask 5. COPYRIGHT: (C)2007,JPO&INPIT
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