发明名称 ANALYTIC METHOD OF CONTENT OF FLUX IN SOLDER PASTE
摘要 PROBLEM TO BE SOLVED: To provide an analytic method for accurately measuring the content of flux by facilitating the elution of the flux to an organic solvent with respect to solder paste having a high melting point. SOLUTION: In the analytic method for measuring the content of flux on the basis of the amount of a separated metal by heating and melting the solder paste in the organic solvent to elute the flux, a metal component for forming an alloy along with the solder metal of the solder paste to lower the melting point of the solder paste is added to the solder paste to heat and melt the solder paste. Alternatively, the solder paste is heated and melted using the organic solvent having a boiling point higher than the melting point of the solder paste. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007010437(A) 申请公布日期 2007.01.18
申请号 JP20050190547 申请日期 2005.06.29
申请人 MITSUBISHI MATERIALS CORP 发明人 KANAI MAKIKO;HAYASHIBE YUTAKA
分类号 G01N25/04 主分类号 G01N25/04
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