| 摘要 |
PROBLEM TO BE SOLVED: To prevent outside air from entering a nitrogen-furnace-type reflow furnace, to prevent atmospheric gas from flowing out of a reflow furnace, and to prevent flux from adhering to a circuit board. SOLUTION: In a first buffering area, or the like provided between the carry-in port of the reflow furnace and a heating chamber, the atmospheric gas in the furnace is sprayed to the circuit board from the lower portion of a carrying device, and the atmospheric gas is sucked at the upper portion of the carrying device, thus preventing the outside air from entering, and preventing the atmospheric gas from flowing out. A flux dropping prevention mechanism is provided in the atmospheric gas suction port, thus preventing the flux from adhering to the circuit board. COPYRIGHT: (C)2007,JPO&INPIT |
