发明名称 |
MULTILAYER FILM, LAMINATE USING SAME, AND METHOD FOR PRODUCING LAMINATE |
摘要 |
<p>Disclosed is a multilayer film for a strain-free laminate which is used for flexible TFT substrates or the like. Also disclosed are a laminate obtained by arranging such a multilayer film on a substrate made of an inorganic material, and a method for producing such a laminate. Specifically disclosed is a multilayer film wherein an adhesive resin layer which can be adhered to inorganic materials is arranged on a film base made of a resin. This multilayer film is characterized in that the average thermal expansion coefficient between 60°C and 80°C measured while heating the multilayer film from 30°C to 130°C is larger by 30-400 ppm/°C than the average thermal expansion coefficient between 60°C and 80°C measured while reheating the multilayer film, which is once heated to 130°C and then cooled to 30°C or less, from 30°C to 130°C. Also specifically disclosed is a laminate obtained by bonding such a multilayer film on at least one surface of a substrate which is made of an inorganic material. Further specifically disclosed is a method for producing such a laminate wherein the multilayer film and the substrate of inorganic material are bonded at a temperature not less than 40°C but not more than the glass transition temperature of a resin constituting the adhesive resin layer of the multilayer film.</p> |
申请公布号 |
WO2006082887(A3) |
申请公布日期 |
2007.01.18 |
申请号 |
WO2006JP301758 |
申请日期 |
2006.02.02 |
申请人 |
ZEON CORPORATION;TANAKA, AKIRA |
发明人 |
TANAKA, AKIRA |
分类号 |
B32B27/00;B32B27/24;C09J7/02;C09J201/02 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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