| 摘要 |
A package substrate may have an improved surface structure for controlling the flow of an adhesive. The package substrate may have an upper surface and a lower surface covered with a passivation layer. A window may be provided in, for example, the center of the package substrate. Sinks may be provided on the lower surface, clear of the passivation layer. The semiconductor package may have an indented or non-planar surface structure.
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