| 摘要 |
A pin grid array package, comprising a substrate, a chip mounted abutting said substrate, and a plurality of pins electrically connected to said substrate, each pin comprising a substantially flat disc at an end of the pin opposite the substrate, said disc oriented perpendicular to said pin. The substrate contains metal traces to transfer electrical signals between the chip and each pin, wherein said disc is usable to provide each pin an electrical connection to a structure external to the package.
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