| 摘要 |
A tape carrier package for a flat display device is provided to significantly reduce the manufacturing cost, thereby improving the productivity, by forming metal wires through electroless-plating. A first metal wire(54) is formed on a base film(50) vertically to the extending direction of the base film, wherein the first metal wire is connected to an input part of a flat display device. A second metal wire(56) is formed on the base film in the same direction of the first metal wire, wherein the second metal wire is connected to an output part of the flat display device. A semiconductor chip(60) is electrically connected to the first and second metal wires. A sealing part(62) covers the first metal wire, the second metal wire, and the semiconductor chip. The first and second metal wires are electroless-plated. |
