Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

摘要

The present invention relates to a multi-layer printed circuit board comprising a core substrate having through holes; and an interlayer resin insulating layer built up on said core substrate, wherein said through holes are constituted by filling a first metal layer formed by electroplating, a metal film formed by electroless plating, sputtering or evaporation and a second metal layer formed by electroplating.