METHOD FOR FORMING SURFACE GRAFT, METHOD FOR FORMING CONDUCTIVE FILM, METHOD FOR FORMING METAL PATTERN, METHOD FOR FORMING MULTILAYER WIRING BOARD, SURFACE GRAFT MATERIAL, AND CONDUCTIVE MATERIAL

摘要

The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.