| 摘要 |
A semiconductor package is provided to reduce the total thickness of the semiconductor package by inserting a heat sink into a substrate. A semiconductor package comprises a substrate(110), a memory chip(120) attached to the substrate, a pair of system chips(130), a heat sink(160), and an EMC(Epoxy Molding Compound)(150) for molding the memory chip, the system chip and a wire. The substrate is provided with a groove(111), a pair of stepped jaws(112), and a bonding pad(113). The system chips are connected to the memory chip by the wire through the bonding pad and attached to the stepped jaws. The heat sink is mounted on both sides of the system chips and inserted in the substrate. |
