发明名称 Heat-peelable pressure-sensitive adhesive sheet
摘要 A heat-peelable pressure-sensitive adhesive sheet which ensures an efficient contact area even in case where the area of an adherend to be adhered is decreased and thus makes it possible to avoid adhesion failures such as chip-scattering or chipping. The heat-peelable pressure-sensitive adhesive sheet comprises a substrate and a heat-expandable pressure-sensitive adhesive layer containing heat-expandable microspheres, formed on at least one side of the substrate, wherein the surface of the heat-expandable pressure-sensitive adhesive layer before heating has a center line average roughness of 0.4 mum or less.
申请公布号 US7163597(B2) 申请公布日期 2007.01.16
申请号 US20030404861 申请日期 2003.04.02
申请人 NITTO DENKO CORPORATION 发明人 MURATA AKIHISA;OSHIMA TOSHIYUKI;ARIMITSU YUKIO;KIUCHI KAZUYUKI
分类号 B32B25/08;B32B37/14;B32B27/00;B32B27/20;C09J5/08;C09J7/02;C09J7/04;C09J11/00;C09J201/00;H01L21/301;H01L21/46;H01L21/78 主分类号 B32B25/08
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