Method of cutting an object and of further processing the cut material, and carrier for holding the object and the cut material

摘要

The invention relates to an object ( 1 ) that is cut by means of a laser and a water beam and to further processing of the cut material. The object is glued on a carrier ( 3 ) that is provided with an adhesive and can be transparent for the radiation used in the water beam ( 7 ). The carrier can be a solid body and preferably a fibrous mat ( 3 ). Said body or mat is penetrated by the water beam. The object ( 1 ) or the cut material thereof is held on the carrier ( 3 ) before, during and after cutting through in such a way that said object or material does not change position. In a preferred embodiment, a silicon wafer is used as the object because of the high cutting exactness to be obtained. Other materials can also be used.