发明名称 Device and manufacturing method for capacitor with horizontally folded dielectric layer
摘要 <p>Capacitors having a horizontally folded dielectric layer and methods of manufacturing is the same are provided. An example method for manufacturing a capacitor includes forming a first insulating layer pattern above a substrate, forming a first silicon epitaxial growth layer above a region of the silicon substrate exposed by the first insulating layer pattern through epitaxial growth of a first silicon layer, selectively etching the first insulating layer pattern, forming a dielectric layer pattern above the lateral surface of the first silicon epitaxial growth layer in a shape of a spacer, and forming a second silicon epitaxial growth layer above the silicon substrate through epitaxial growth of a second silicon layer. A capacitor including electrodes made of the first and second silicon epitaxial growth layers with the dielectric layer pattern formed therebetween may be formed by such a method.</p>
申请公布号 KR100670398(B1) 申请公布日期 2007.01.16
申请号 KR20040115642 申请日期 2004.12.29
申请人 发明人
分类号 H01L21/8242 主分类号 H01L21/8242
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