| 摘要 |
PROBLEM TO BE SOLVED: To decrease a contact frequency between a measuring terminal of a device to be tested and a stylus of a probe card, and to decrease the generation of a foreign matter upon contact. SOLUTION: A first probe card 21 and a second probe card 22 are used at an upper part and a lower part in a tester. The first probe card 21 is provided with a first stylus 21a connectable to a measuring terminal 41 of a device to be tested, and a first connection terminal 21b for transmitting a testing electric signal. The second probe card 22 is provided with a second stylus 22a connectable to a first connection terminal 21b, and a second connection terminal 22b for transmitting the testing electric signal from the outside. In a state that each measuring terminal 41 of all the devices to be tested on a semiconductor wafer 4 comes into contact with the first stylus 21a of the first probe card 21, the semiconductor wafer 4 integrated with the first probe card 21 is moved toward the second probe card 22 in an arbitrary setting order, whereby one or each of a plurality of semiconductor devices is tested. COPYRIGHT: (C)2007,JPO&INPIT
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