| 摘要 |
PROBLEM TO BE SOLVED: To provide a fluidity evaluation method serving as a proper index for sealing a semiconductor element, along with a liquefied sealing material, based upon the index. SOLUTION: In the fluidity evaluation method of a liquefied sealing material, a liquefied sealing material of a fixed quantity is dropped on a flat plate, and is held at a specified tilt angle in the atmosphere of a specified temperature for a specified duration to know a flowing distance of the liquefied sealing material during the period as an index of fluidity. The liquefied sealing material of 3-100 mg is preferred to be dropped, which is held at the tilt angle of 45-90°in the atmosphere of 10-150°C for 1-20 minutes. The liquefied sealing material contains epoxy resin, curing agent, and filler, and if it is dropped by 10 mg on the flat plate whose surface is polyimide resin, and is held at the tilt angle of 90°in the atmosphere 100°C for 10 minutes, the flow distance during the period is 10-30 mm. COPYRIGHT: (C)2007,JPO&INPIT
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