| 摘要 |
PROBLEM TO BE SOLVED: To remove a wafer without using a vacuum source in a wafer carrier employing a gel sheet. SOLUTION: The wafer carrier has such a structure as a gel sheet 2 is provided on a tray 1 and the gap between them is filled with magnetic dispersion solution 3 and a magnetic substance 5. When a wafer 4 is removed, magnets 6 are arranged, at a predetermined interval, on the rear surface of the tray 1. Consequently, the magnetic substance 5 is omnipresent directly above the magnet 6 and protrusions and recesses are formed on the surface of the gel sheet 2 depending on its distribution. Contact area between the gel sheet 2 and the wafer 4 are thereby decreases and the wafer 4 can be removed easily by means of pincettes 7. Consequently, the wafer 4 can be removed without using a vacuum source. COPYRIGHT: (C)2007,JPO&INPIT |
