| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic parts which are to be plated with the film having a partially different composition or a partially different thickness, and to provide a plating method which can plate the electronic parts with the film having the partially different composition or the partially different thickness. SOLUTION: These electronic parts have a base 1 which is equipped with an electrical element and has a plated film thereon, and an insulated lead 4 which is arranged in the base 1, is used for external connection and has a plated film thereon. The base 1 and the lead 4 are configured so that the films plated on them have a different material composition from each other. COPYRIGHT: (C)2007,JPO&INPIT
|
