发明名称 DEVICE AND METHOD OF MANUFACTURE OF AN INTERCONNECTION STRUCTURE FOR PRINTED CIRCUIT BOARDS
摘要 An interconnection structure for coupling conductive layers (126 and 128) of a circuit board (122) includes a pin (138) configured to be press-fitted in an aperture traversing the circuit board, to electrically couple the conductive traces. The pin may be placed in a predrilled aperture, or driven into the circuit board, forming the aperture thereby. The pin may also be configured as a punch, removing a plug of material as it is driven therethrough. The pin may comprise a capacitive or resistive region configured to capacitively or resistively couple the first and second traces. The pin may be configured such that capacitive or resistive values are selectable according to a depth to which the pin is positioned in the aperture. The pin may serve as an offset post for mounting the circuit board to a chassis. In such a case, the pin may be provided with a longitudinal aperture configured to receive a threaded screw.
申请公布号 WO2006007166(A3) 申请公布日期 2007.01.11
申请号 WO2005US17926 申请日期 2005.05.20
申请人 JOY, STEPHEN, C. 发明人 JOY, STEPHEN, C.
分类号 H01R12/04;H05K1/18;H05K3/30;H05K3/34;H05K3/40 主分类号 H01R12/04
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