| 摘要 |
In a high frequency package device includes a bottom plate, a side wall, a lid, a dielectric plate, an input line, an output line and a projection. The side wall is provided on the bottom plate, and configured to surround a space above the bottom plate. The lid is configured to close an opening formed by the side wall. The input line and the output line are configured to penetrate through the side wall. The projection is provided at a part of the inner surface of the lid to make the distance to the bottom plate short.
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