| 摘要 |
PROBLEM TO BE SOLVED: To provide an interconnecting method for circuit boards whereby a connection ease can be achieved, without requiring additional working processes, such as embossing work. SOLUTION: The interconnecting method for circuit boards includes a process (i) for preparing a first circuit board having the ends of a plurality of conductor wirings as its connection, and a second circuit board having the ends of a plurality of corresponding conductor wirings as its connection; a process (ii) for so disposing a thermosetting bonding film as to interpose it between the connections of the first and second circuit boards; and a process (iii) for applying ample heat and pressure to the connecting portions and the thermosetting bonding film, to cast a side the bonding film, and to harden the bonding agent thereof, in order make the connections of the facing circuit boards contact electrically with each other. Hereupon, there are included nonlinear wirings in the conductor wirings, constituting at least a connecting portion of those of the first and second circuit boards. COPYRIGHT: (C)2007,JPO&INPIT |
