发明名称 THERMALLY CONDUCTIVE COMPOSITE SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive composite sheet that has a mold-release characteristic and can easily combine pressing-resistance and thermal conductivity. <P>SOLUTION: The thermally conductive composite sheet 10 comprises a graphite layer 1 and a fluorocarbon resin layer 2 prepared on at least one principal surface of this graphite layer 1, wherein the thickness of the graphite layer 1 is in the range of≥80μm and≤400μm and wherein the thickness of the fluorocarbon resin layer 2 is in the range of >2μm and≤30μm. This thermally conductive composite sheet can be easily wound up into an object of a roll shape without damaging, and suitably used for manufacturing an electronic component assembly. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007001302(A) 申请公布日期 2007.01.11
申请号 JP20060143904 申请日期 2006.05.24
申请人 NITTO DENKO CORP 发明人 TAKAOKA SEIICHI;SUZUKI SHINJI;NAGAYAMA TOMOYOSHI
分类号 B32B9/00;B32B27/30;H01L21/60 主分类号 B32B9/00
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