SUBSTRATE HAVING SHIFTED CORE LAYER AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

A wiring board and a semiconductor device having the same are provided to suppress bending or deformation of the wiring board at a hot process by forming a core layer opposite to a surface on which a semiconductor chip is formed. A wiring board includes a board body(155) consisting of a core layer(154) formed on a center portion and an insulation layer(153) deposited on upper and lower surfaces of the core layer. The core layer is formed in the insulation layer when the core layer is positioned towards a surface on which a semiconductor chip(110) is not formed. The core layer is made of a material having thermal expansion coefficient lower than that of the insulation layer.