| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is provided with a power supply wiring structure enough to generate power supply capacity, reduce power supply noises, and supply stable power supply without reducing the intgeration of circuits. SOLUTION: The semiconductor device is provided with a plurality of conductive layers. In this case, power lines with different two potentials, e.g. power supply line and ground line, are arranged opposite to each other with an interlayer dielectric in-between, so that a capacitor may be formed between the wirings. Therefore, the consumption quantity of a wiring resource in the same plane is suppressed without lowering the integration of circuits and the power supply noises are reduced, as compared with the conventional method wherein the power supply line and the ground line are added in the same plane. In addition, when such the wiring structure is employed, the resistance of the power supply wiring is reduced because of the connection relationship of the power supply wirings, so that the quantity of current supply can be increased and stabilized and the power supply noises be also reduced. COPYRIGHT: (C)2007,JPO&INPIT
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