| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mounted electronic device capable of preventing the occurrence of failures such as poor connections and falling-off of a circuit component due to the occurrence of cracks in solder caused by a heat cycle, vibrations, and shocks or the like, when a pad on a mounting substrate and an electrode of the circuit component are connected with each other by soldering even while using a glass-epoxy resin material having a higher thermal expansion coefficient though it is inexpensive as a mounting substrate. <P>SOLUTION: A circuit wiring substrate 2 includes an insulating substrate 3 composed of a material high in thermal expansion, a wiring pattern 4 formed to the upper part of the insulating substrate, and a mounting electrode 5 formed to the bottom part of the insulating substrate. The circuit component 20 includes an insulating container 21 composed of a material low in thermal expansion, and a bottom electrode 22 formed to the bottom part of the insulating container. The surface-mounted electronic device is composed so that the circuit component 20 is mounted on the circuit wiring substrate 2. A lower connection pad of an intermediate substrate 10, in which connection pads 12, 13 are respectively provided to the upper part, and the lower part of an insulating substrate 11 composed of a material medium in thermal expansion, is connected to a part on the wiring pattern on the circuit wiring substrate by soldering. The bottom electrode of the circuit component is connected and fixed to the upper connection pad of the intermediate substrate by soldering. <P>COPYRIGHT: (C)2007,JPO&INPIT |
