发明名称 Connector-to-pad printed circuit board translator and method of fabrication
摘要 In one embodiment, a laminated printed circuit board translator is provided. In some embodiments, the translator includes a receiving board adapted to receive a pin, the receiving board includes a plated via extending through the receiving board and has a hole for receiving a pin. An interface board laminated with the receiving board has a controlled depth via extending through it to contact a conductive trace. The conductive trace extends between the receiving board and the interface board to connect the plated via of the receiving board with the controlled depth via of the interface board. The controlled depth via is configured so that it is capable of being plated through a single sided drilled opening in the interface board. Some embodiments have a pad on the interface board connected to the controlled depth via.
申请公布号 US2007007034(A1) 申请公布日期 2007.01.11
申请号 US20060474921 申请日期 2006.06.26
申请人 BEHZIZ ARASH;YAGHMAI ROYA 发明人 BEHZIZ ARASH;YAGHMAI ROYA
分类号 H05K1/11;H05K3/42 主分类号 H05K1/11
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