发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, AND, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PARTITION WALL FOR PLASMA DISPLAY PANEL USING THE COMPOSITION |
摘要 |
<p>A photosensitive resin composition which comprises (A) a binder polymer, (B) a photo-polymerizable compound having a polymerizable ethylenic unsaturated bond, (C) a photo-radical polymerization initiator comprising a 2,4,5-triaryl imidazole dimer or a derivative thereof and (D) a compound represented by the following general formula (1): (1) wherein R<SUP>1 </SUP>and R<SUP>2</SUP> each independently represent an alkyl group having 1 to 20 carbon atoms or the like, and R<SUP>3</SUP>, R<SUP>4</SUP>, R<SUP>5</SUP>, R<SUP>6</SUP>, R<SUP>7</SUP>, R<SUP>8</SUP>, R<SUP>9</SUP> and R<SUP>10 </SUP>each independently represent a hydrogen atom or the like.</p> |
申请公布号 |
WO2007004619(A1) |
申请公布日期 |
2007.01.11 |
申请号 |
WO2006JP313245 |
申请日期 |
2006.07.03 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD.;MIYASAKA, MASAHIRO;KUMAKI, TAKASHI |
发明人 |
MIYASAKA, MASAHIRO;KUMAKI, TAKASHI |
分类号 |
G03F7/031;G03F7/004;G03F7/029;H01J9/02;H01J11/02;H01J11/22;H01J11/34;H01J11/36;H05K3/00;H05K3/06 |
主分类号 |
G03F7/031 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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