| 摘要 |
<p>The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.</p> |
