发明名称 METHOD FOR SELECTIVE ETCHING
摘要 Disclosed is a method of selective etching a first material on a substrate with a high selectivity towards a second material by flowing a liquid etchant across a substrate surface at a flow sufficient fast to generate a mininun mean velocity v parallel to the substrate's surface. ® KIPO & WIPO 2007
申请公布号 KR20070005612(A) 申请公布日期 2007.01.10
申请号 KR20067018098 申请日期 2006.09.05
申请人 SEZ AG 发明人 KRAUS HARALD;CLAES MARTINE
分类号 H01L21/3063;H01L21/311;H01L21/336 主分类号 H01L21/3063
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