| 摘要 |
Provided is a radiation curable conductive ink, which forms a conductive substrate via chemical crosslinking upon the irradiation of UV rays, visible rays or electron beams, and is useful as a material for producing layered electronic devices. The radiation curable conductive ink comprises: conductive powder having an average size of 40 micrometers or less; a cover layer for covering the surface of the conductive powder; and a photosensitive bonding agent having a viscosity of 5,000 cps or less at 25 deg.C and containing at least one reactive cyclic polymerizable organic compound. Before covering with the cover layer, the conductive power shows a silver content corresponding to 90% or less of the weight of the conductive powder before covering with the cover layer. The cover layer has a silver content corresponding to 30% or more of the weight of the cover layer, and the cover layer has a weight corresponding to 80% or less of the total weight of the conductive powder and the cover layer. |
