发明名称 Metal-insulator-metal device
摘要 A method for forming a metal-insulator-metal device includes imprinting at least one first layer to form a first impression, removing a portion of at least one second layer through the first depression to form a recess in the at least one second layer bordered by a first side, a first overhang along the first side, a second opposite side and a second overhang along the second side. The method also includes depositing a first metal in the recess spaced from the first side and the second side and oxidizing the first metal to create a non-linear dielectric.
申请公布号 US7160745(B2) 申请公布日期 2007.01.09
申请号 US20040975940 申请日期 2004.10.28
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 ULMER KURT;WENG JIAN-GANG;MARDILOVICH PETER;RUDIN JOHN CHRISTOPHER
分类号 H01L21/00 主分类号 H01L21/00
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