IC SWITCH CARRIER PACKAGED WITH CWBI AND METHOD THEREOF

摘要

A packaged IC(Integrated Circuit) switch carrier apparatus using a coplanar wire-bond interconnection and a method thereof are provided to acquire a high isolation characteristic of an IC switch by connecting input/output terminals of the IC switch based on a coplanar wire-bond interconnection. A first signal pad(210) is located on input/output terminals of an IC switch and connects a signal. A first ground pad(209) is located on the input/output terminals of the IC switch and grounds the IC switch. A second signal pad(206) is located on input/output terminals of an IC switch carrier apparatus and connects a signal. A second ground pad(204) is located on the input/output terminals of the IC switch carrier apparatus and grounds the IC switch carrier apparatus. A connection unit connects the first signal pad(210) to the second signal pad(206), and connects the first ground pad(209) to the second ground pad(204). A ground unit grounds the second ground pad(204).