| 摘要 |
<p>In general, in one aspect, the invention features methods for forming structured materials that include providing a layer including a first material; patterning the layer while a surface of the layer is exposed without the need for a processing layer, such as a resist; permeating the patterned layer with a precursor; and reacting the precursor within the pattemed layer to form a structured material. ® KIPO & WIPO 2007</p> |
