<p>An IC card chip (1c) has an IC card function and a memory card function. A semi-finished module (SFM)(4) having the portion of the memory card function of the IC card chip (1c) is prepared. The SFM (4) has a wiring substrate (4c), two semiconductor chips (4d, 4e) mounted on a first main surface of the wiring substrate, and a resin sealing body (4f) for sealing them. A memory circuit is formed on the semiconductor chip (4d), and an interface controller circuit for controlling operation of the memory circuit (M) is formed on the semiconductor chip (4e). External terminals (4a) are arranged on a part of the upper surface of the SFM (4) so as to be exposed to the outside of the SFM (4).</p>
