发明名称 |
Method and apparatus for reducing substrate backside deposition during processing |
摘要 |
A focus ring assembly configured to be coupled to a substrate holder comprises a focus ring and a secondary focus ring coupled to the focus ring, wherein the secondary focus ring is configured to reduce the deposition of process residue on a backside surface of the substrate.
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申请公布号 |
US2007000614(A1) |
申请公布日期 |
2007.01.04 |
申请号 |
US20040549283 |
申请日期 |
2004.03.17 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
HATAMURA YASUNORI;HINATA KUNIHIKO |
分类号 |
H01L21/306;C23C16/00;H01J37/32 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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