发明名称 Method and apparatus for reducing substrate backside deposition during processing
摘要 A focus ring assembly configured to be coupled to a substrate holder comprises a focus ring and a secondary focus ring coupled to the focus ring, wherein the secondary focus ring is configured to reduce the deposition of process residue on a backside surface of the substrate.
申请公布号 US2007000614(A1) 申请公布日期 2007.01.04
申请号 US20040549283 申请日期 2004.03.17
申请人 TOKYO ELECTRON LIMITED 发明人 HATAMURA YASUNORI;HINATA KUNIHIKO
分类号 H01L21/306;C23C16/00;H01J37/32 主分类号 H01L21/306
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