发明名称 |
Semiconductor device and portable apparatus and electronic apparatus comprising the same |
摘要 |
A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such that at least a part of its lower surface is exposed from a lower surface of the sealing resin. The method includes a punching step for forming the lead by punching processing in a direction from the lower surface to its upper surface and a coining step for subjecting the lead to coining processing from the side of the upper surface after the punching processing. |
申请公布号 |
US2007001276(A1) |
申请公布日期 |
2007.01.04 |
申请号 |
US20060518901 |
申请日期 |
2006.09.12 |
申请人 |
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发明人 |
KISHIMOTO ICHIRO |
分类号 |
H01L23/495;H01L23/50;H01L21/44;H01L21/48;H01L21/50;H01L23/31 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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