| 摘要 |
A package is disclosed for routing high frequency signals and low frequency signals between an integrated circuit device and other components. A package includes a thickfilm substrate having thickfilm interconnects, and a printed circuit board having printed circuit interconnects. A microcircuit system is disclosed for routing high frequency signals and low frequency signals. A microcircuit system comprises an integrated circuit device, a microcircuit package having a thickfilm substrate and a printed circuit board, high frequency connectors in attachment with the thickfilm interconnects, and low frequency connectors in attachment with the printed circuit interconnects. A method for routing high frequency signals and low frequency signals is disclosed. One method includes attaching low frequency portions of an integrated circuit device, printed circuit interconnects, and other components together, and attaching high frequency portions of the integrated circuit device, thickfilm interconnects, and other components together. |
