METHOD FOR MANUFACTURING IMAGE SENSOR

摘要

A method for manufacturing an image sensor is provided to prevent corrosion of a wire bonding pad by forming and removing a micro-lens after forming a thin film resist on the wire bonding pad. A passivation layer(201) is formed on a semiconductor substrate(100) including optical sensing units(103) and a wire bonding pad(105). The wire bonding pad is opened by removing a part of the passivation layer from an upper part of the wire bonding pad. A thin film resist(202) is formed on the passivation layer and the opened wire bonding pad. A color filter array(203) is formed on the thin film resist. A plurality of micro-lenses(207) are formed on the color filter array. The thin film resist is removed by etching the thin film resist.