System and method for mounting electronic components onto flexible substrates

摘要

A system and method for reflowing solder to interconnect a plurality of electronic components ( 24 ) to a substrate ( 12 ) is disclosed. The system includes an oven for preheating the substrate ( 12 ) and the plurality of electronic components ( 24 ) disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder ( 72 ), a pallet ( 14 ) for supporting the substrate ( 12 ), wherein the pallet ( 14 ) has at least one internal cavity ( 40 ), and a phase-transition material ( 42 ) disposed within the cavity ( 40 ) for absorbing heat from the pallet ( 14 ).