发明名称 POSITIVE RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition using a low-molecular-weight resin as a base resin and capable of forming a high-resolution resist pattern, and to provide a method of forming a resist pattern. <P>SOLUTION: The positive resist composition contains a resin component (A) whose alkali solubility is increased by the action of an acid and an acid generator component (B) which generates an acid upon irradiation with a radiation, wherein the resin component (A) is the above resin having a mass average molecular weight of &le;4,000 obtained by anionic polymerization. <P>COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006349911(A) 申请公布日期 2006.12.28
申请号 JP20050174899 申请日期 2005.06.15
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TAKESHITA MASARU;UCHIUMI YOSHIYUKI;HAYASHI RYOTARO
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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