| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a highly reliable semiconductor module by using laser light in packaging. <P>SOLUTION: The manufacturing method of the semiconductor module comprises a step for locating a semiconductor element 150 above a wiring board 164, a step for touching a first bump 157 of first wiring 153 and a first pad 254 of a first electrode through a first bonding member 155, and making the second bump 167 of the second wiring 163 touch with the second pad 154 of a second electrode through a second bonding member 165, and a step for thermally bonding the first and second bonding members 155 and 165 by irradiating them with laser light 137 exiting a laser element wherein irradiation conditions of the laser light 137 used in the step for bonding the first bump 157 and the first pad 254 are different from irradiation conditions of the laser light 137 used in the step for bonding the second bump 167 and the second pad 154. <P>COPYRIGHT: (C)2007,JPO&INPIT |
