| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet probe for wafer inspection surely attaining a satisfactory electric connecting state even in a wafer with an extremely small pitch of inspection object electrodes, and applications thereof. SOLUTION: This sheet probe for wafer inspection comprises: an insulating sheet having a plurality of through-holes extending in the thickness direction according to a pattern corresponding to the pattern of inspection object electrodes in all or a part of integrated circuits formed on a wafer; and an electrode structure arranged in each of the through-holes of the insulating sheet so as to protruded from both sides of the insulating sheet. In the electrode structure, a surface electrode part exposed to the surface side of the insulating sheet with a diameter larger than the diameter of the surface-side opening of the through-hole of the insulating sheet, and a reverse electrode part exposed to the reverse side of the insulating sheet with a diameter larger than the diamrter of the reverse-side opening of the through-hole of the insulating sheet, are connected through a short-circuit part inserted to the through-hole of the insulating sheet, and movable in the thickness direction relative to the insulating sheet. COPYRIGHT: (C)2007,JPO&INPIT
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