发明名称 |
Pad layouts of a printed circuit board |
摘要 |
A pad layout of a printed circuit board includes a first and a second pad symmetrically arranged on the PCB for cooperatively receiving either a first surface mounted component (SMC) or a second surface mounted component (SMC). Each of the SMCs includes a first footprint and a second footprint. The first pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the first footprint of the first SMC and a shape of the first footprint of the second SMC. The second pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the second footprint of the first SMC and a shape of the second footprint of the second SMC.
|
申请公布号 |
US2006294489(A1) |
申请公布日期 |
2006.12.28 |
申请号 |
US20060472975 |
申请日期 |
2006.06.21 |
申请人 |
HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
TAI CHAN-FEI;HUANG YA-LING |
分类号 |
G06F17/50 |
主分类号 |
G06F17/50 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|