| 摘要 |
The present invention aims to improve the polishing rate during the polishing process of semiconductor substrates, hard disk substrates or the like by using a polishing composition containing silica particles, water, a basic substance and an inorganic salt, and by a polishing method using such a polishing composition. This polishing composition can be produced by mixing silica particles, water, a basic substance and an inorganic salt, and it is also obtained by adding an inorganic salt into a conventionally known alkaline polishing composition containing silica particles. As the inorganic salt, there is used an alkali metal salt or an ammonium salt such as KCl, K 2SO4, KNO3, NaCl, Na2SO4, NaNO3, NH4Cl, NH4NO3 and (NH4)2SO4. A polishing composition, wherein silica particles do not agglomerate when an inorganic salt is added, can improve the polishing rate significantly.
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