| 摘要 |
PROBLEM TO BE SOLVED: To provide a movable element facilitating a manufacturing process, never disturbing reduction of a package size, and having low voltage/low power consumption to an extent allowing itself to be integrally formed with a low voltage/low power consumption-based element; to provide a semiconductor device with the movable element incorporated therein; to provide a module; and to provide an electronic apparatus. SOLUTION: This movable element is provided, on a semiconductor substrate 10, with: a signal line 11 for transmitting a signal; a connection/disconnection part 12 for mechanically connecting and disconnecting the signal line; switching parts 13 for switching the connection/disconnection part 12; and holding parts 14 for holding a state after the switching of the connection/disconnection part 12. The connection/disconnection part 12, each switching part 13 and each holding part 14 have a set of stationary pieces 12A, 13A and 14A and movable pieces 12B, 13B and 14B arranged oppositely to each other, respectively; and the movable piece 14B of the holding part 14 is connected to the respective movable pieces 12B and 13B of the connection/disconnection part 12 and the switching part 13 through elastic parts 15. COPYRIGHT: (C)2007,JPO&INPIT
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