| 摘要 |
PROBLEM TO BE SOLVED: To provide an etchant composition having a high silicon etching speed and capable of reducing a silicon etching process time while maintaining etching characteristics such as an etching speed ratio depending on crystal surfaces and smoothness of an etching surface in silicon etching, and an etching method of silicon employing this etchant composition. SOLUTION: The etchant composition used for silicon microfabrication contains inorganic alkali compound and hydroxylamines. The inorganic alkali compound is at least one kind selected from among sodium hydroxide, potassium hydroxide, ammonia and hydrazine. The hydroxylaminesis is at least one kind selected from among hydroxylamine, hydroxylamine sulfate, hydroxylamine chloride, hydroxylamine oxalate, dimethyl hydroxylamine hydrochloride and hydroxylamine phosphate. COPYRIGHT: (C)2007,JPO&INPIT
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